Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS Technology solves this common problem using strategic patterns of partially closed foam cells. Now available on our Heavy Duty Orbital (HDO) pads, giving the operator the added benefit of the durable, dual layer design and tapered edge.

Benefits:

• Slow Rate of Polish Absorption – CCS pockets gradually release polish as needed by the operator.
• Prevents Pad Skipping – CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
• Dual Layer – The dual layer design reduces lateral/horizontal movement, resulting in a reduction of friction inside the pad which increases durability by eliminating excessive heat and reduces foam fatigue.

Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS Technology solves this common problem using strategic patterns of partially closed foam cells. Now available on our Standard Duty Orbital (SDO) pads, giving the operator the same consistent performance of our SDO pads, with the added benefit of CCS technology.

Benefits:

• Slow Rate of Polish Absorption – CCS pockets gradually release polish as needed by the operator.
• Prevents Pad Skipping – CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
• Tapered Edge – Prevents pad rolling and provides great pad rotation which is great for curved and contoured panels. This allows for precision polishing in tight areas.

Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS technology solves this common problem using strategic patterns of partially closed foam cells.

Benefits:

• Slow Rate of Polish Absorption – CCS pockets gradually release polish as needed by the operator.
• Prevents Pad Skipping – CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
• Creates less Heat – CCS pockets reduce surface contact resulting in less friction generated heat.

Conventional foam pads gradually absorb compound and polish. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS technology solves this common problem using strategic patterns of partially closed foam cells.

Benefits:

• Slow Rate of Polish Absorption – CCS pockets gradually release polish as needed by the operator.
• Prevents Pad Skipping – CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
• Creates Less Heat – CCS pockets reduce surface contact resulting in less friction generated heat.

Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS technology solves this common problem using strategic patterns of partially closed foam cells.

Benefits:

• Slow Rate of Polish Absorption – CCS pockets gradually release polish as needed by the operator.
• Prevents Pad Skipping – CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
• Creates less Heat – CCS pockets reduce surface contact resulting in less friction generated heat.